Stars-922 Heatsink Plaster which is high conductivity, low bleed, stable at high temperatures, viscosity control better, with just a little more force to remove the heat sink (rotating around a few can be removed), removed after wipe clean with paper towels. Primary Use: Thermal coupling of nozzle for 3D printer, elastic adhesion, heat dissipation, insulation and encapsulation in electronics, electrical appliances, instruments, LED, heat sinks and other industries.
Thermal conductivity: >0.671W/m.k
Surface curing time: 10MIN/25
Because of its high viscosity, we don't recommend using it on the CPU or GPU processor.