ADHESIVE - THERMAL CONDUCTIVE EPOXY, MEDIUM CURE (RATIO 1:1)

ADHESIVE - THERMAL CONDUCTIVE EPOXY, MEDIUM CURE (RATIO 1:1)
All pictures are for illustrative purposes only.

PID# 16240

CA$25.95
Free shipping: On orders over $120 within BC

3 In Stock

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Description

This product is very viscous because it is highly filled with thermally conductive ceramic powders for maximum thermal conductivity. It bonds well to metals, ceramics, glass, and most plastics used in electronic assemblies.

It has a convenient 1-to-1 ratio, a 45 minutes working time, and a moderate curing rate. It may achieve a minimal service cure in seven hours at room temperature.

This product comes packaged in separate 3ml syringes that can be accurately dispensed, or in 50ml or 200ml kits packaged in tubs.

Features

  • Thermal conductivity: 1.36 W/(m·K)
  • 1:1 mix ratio
  • Working time: 45 minutes
  • Cure time: 1 hour @ 65°C, or 24 hours at room temperature
  • Good adhesive strength
  • Strong resistance to water, brine, acids, bases, and aliphatic hydrocarbons
  • Room temperature storage
  • Shelf life greater than two years

Applications & Usages

This product is designed to bond heat sinks, LED’s, and other heat generating components in electronic assemblies. It is suitable for manufacturing, repair, and hobbyist environments. Use it when a thixotropic adhesive paste with maximum thermal conductivity and a moderate working time is required. For automatic dispensing applications, use the 8329TFM, which has a lower viscosity but slightly lower thermal conductivity.

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