CAIG SILICONE HEAT SINK COMPOUND, 6G, HSC67-6G, 0.67W/m.K

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PID# 161288

CA$11.00
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20 In Stock

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Description

CAIG Brand Silicone Heat Sink Compound

Transfer Heat Away from Electronic Components and Parts

Thermally conductive compounds are grease like silicone materials, heavily filled with heat-conductive metal oxides. This combination promotes high thermal conductivity, low bleed and high-temperature stability. The compounds are designed to maintain a positive heat sink seal to improve heat transfer from the electrical/electronic device to the heat sink or chassis, thereby increasing the overall efficiency of the device. A cooler device allows for more efficient operation and better reliability over the life of the device. Thermally conductive materials act as a thermal “bridge” to remove heat from a heat source (device) to the ambient via a heat transfer media (i.e. heat sink).

USE: Apply to all mounting and threaded surfaces of the device and chassis.
CONTAINS: Zinc oxide and polydimethyl siloxane.

Transfer heat away from; Heat Sinks, Transistors, Power Diodes, Semi-Conductors Ballast’s & Thermocouple Wells.

Thermal Conductivity: 0.67 Watts per meter K
Specific Gravity: 2.1 @25OC
Silicone and Zinc Oxides
Viscosity: 542000 mPa.s
Shelf Life: 60 months

Safety Datasheet

Specifications

20 Items

Features

Thermal Conductivity 0.67W/m.K

Specific References

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