TWO PART (A/B) SILICONE ENCAPSULANT (1:1) POTTING MATERIAL 100G

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PID# 17854

CA$45.00
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Description

This is supplied as a two-part kit. It consists of two liquid components, A and B. When the two components are fully mixed at ratio of 1:1, the mixed liquid will solidify into a yellow transparent elastomer. This material is flexible with high fluidity and insulation that is convenient to use. It has low viscosity, low temperature resistance and adhesiveness are perfect for the potting and sealing of precision components.

This is a potting material is rated IP65 when done properly. This chemical is a two part set (A/B) and is meant to mix equal parts (ex. if you use 23g part A, use 23g part B). It is recommended to use a scale to measure your amounts poured.

Typical applications:

  • sealing electrical components with weather resistance

HOW TO USE:

  1. Clean your PCB board, make sure that it is dust/dirt/residue free.
  2. Begin to pour part A into a cup using a scale to measure the amount needed.
  3. Mix part A, so there is no visible settlement on the bottom.
  4. Begin to pour part B into another cup using a scale to measure the equal amount from part A poured.
  5. Mix part B, so there is no visible settlement on the bottom.
  6. Pour part B into part A and mix thoroughly
  7. After mixing part A and B together, wait 5-10 minutes to let the air bubbles escape.
  8. Pour the mixture onto your PCB board
  9. Wait 10-48 hours @25C (ideal), for the silicone to harden. Time varies in the range depending on how much you used.

Specifications:

  • Color: yellow transparent (A) , transparent (B)
  • Density (g/cm^3): 1.12 (A), 0.98 (B)
  • Mixing ratio: 1:1
  • Mixing viscosity (cps): 1300
  • Operating time (25C) : 30-40minutes.
  • Surface dry time (25C) : 4-6 hours
  • Curing time (25C): 12 months
  • Tensile Strength (psi): 420
  • Tensile Strength (%) 85
  • Coefficient of thermal expansion (ppm): 200
  • Thermal Conductivity (W/MK): 0.22
  • Effective Temperature range (C): -60-125
  • Dielectric strength: (volts/mil): 420
  • Insulation constant (1kHz): 3.5
  • Dissipation factor (1kHz): 0.015
  • Volume resistivity, chm/cm: 1.5x10^13

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