Footprint provided for commonly used connectors including: DB-9, DB-25, SPDT switch, RJ11 modular phone jacks (2), 1/8" sub-mini connectors (2) or modular handset jacks (2), coaxial power connector, BNC connectors (2)
Reduces cut trances and jumper wires to speed prototype assembly. The BusBoard zig-zag pattern can be used to connect DIP ICs and DIL header pin-to-pin.
Single-sided, 1oz/ft2 copper, anti-tarnish coating for easy soldering. Lead free and RoHS compatible. High-quality FR4 glass-epoxy circuit board with solder mask.
76 separate BusBoard traces, 0.037" holes are drilled on 0.1" (2.54mm) centers.
Standard single hiehgt (3U) Eurcard/VME size. 3.9" wide, 6.3" long, 1/16" thick (100 X 160 X 1.6mm).