Performance before curing:

• Colour: Transparent
• Viscosity: A(1200) B(90)
• Density(g/cm^2): A(1.02) B(0.98)
• Pot Duration: 30 minutes (25C)
• Surface drying time: 1-3 hours (25C)
• Cure Colour: transparent
• Shelf Life: 12 months (25C)

Performance after curing:

• Gel hardness: 25A
• Thermal expansion coefficient: 1.3x10^-5 C
• Temperature range: -60C - 210C
• Thermal conductivity: 0.22W/MK
• Volume resistance: 1.2x10^16 (ohm.cm)
• Withstand Voltage: 19(kV/mm^2)

Overview:

• Low viscosity before curing, perfect to get into small gaps of circuit boards
• High Transparency: very easy to look through the cured silicone and see electrical components.
• Excellent water resistance: after potting and solidification, provides waterproofing to electrical components
• High Insulation: Has excellent electrical insulation properties with good electrical insulation resistance and dielectric strength
• Stable in high and low temperatures.

Usage:

1. Before potting, ensure that the electrical component(s) you are working on is clear of dust, moisture, and oils.
2. Prepare a scale with a clean container and set the scale to 0g with the container on the scale.
3. Pour 50g solution A into the container
4. Pour 5g solution B into the container
5. Steps 3 and 4 can be done in any 10:1 ratios
6. Mix the mixture well, make sure to stir the sides and the bottom of the container as well to stir the mixture evenly. If not it may not cure properly
7. After mixing, wait 5 minutes to facilitate the discharge of air bubbles. If you have a vibration plate, this process can be done quicker.
8. Pour the mixture onto your electrical component after all the air bubbles have been released.
9. Wait until cured completely.
10. Volia! Potting is complete! If you need to remove the silicone, it is easy to do so by just peeling with your finger nails.