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FUSE, SCHURTER, UMT250, SLOW 250VAC 2.5A 10.1X3MM SMD
Description
Features:
High breaking capacity of 200 A @ 250 VAC (IEC)
UL approval for 277 VAC and 250 VDC
Impermeable to potting compound used to achieve hermetic seal for use in intrinsically safe applications according to ATEx and IECEx requirements.
Unique Selling Proposition
Compact design
Maximum breaking capacity at minimal footprint
Suitable for pulse-shaped continuous currents
Applications
Primary protection on SMD PCBs
Medical Equipment
Battery protection
Technical Data
Rated Voltage: 250 VAC, up to 250 VDC
Rated current 2.5A
Breaking Capacity 35 A - 200 A
Characteristic: Time-Lag T
Mounting PCB,SMT
Admissible Ambient Temp.-55 °C to 125 °C
Climatic Category55/125/21 acc. to IEC 60068-1
Material: Housing Ceramics
Material: Terminals Copper alloy, tin-plated
Unit Weight: 0.23 g
Storage Conditions 0 °C to 60 °C, max. 70% r.h.
Product Marking: Schurter_Prüfzeichen, UMF_Prüfzeichen, Rated current, Voltage, Characteristic, Breaking Capacity
Soldering Methods: Reflow, Wave
Solderability 245 °C / 3 sec acc. to IEC 60068-2-58, Test Td
Resistance to Soldering Heat: 260 °C / 10 sec acc. to IEC 60068-2-58
Moisture Sensitivity Level: MSL 1, J-STD-020
Moisture Resistance Test: MIL-STD-202, Method 106 (50 cycles in a temp./mister chamber)
Operational Life: MIL-STD-202, Method 108 (1000h @ 0.42*In @ 70°C)
Mechanical Shock: MIL-STD-202, Method 213 Condition A
Resistance to Solvents: MIL-STD-202, Method 215
Terminal Strength: MIL-STD-202, Method 211A (Deflection of board 1 mm for 1 minute)