SOLDER, MG, SAC305, NO CLEAN, PB FREE, 3% AG PASTE 4900P-25G

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PID# 160604

34,50 CA$
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Description

4900P SAC305 Solder Paste is a no-clean solder paste made from a blend of high-purity, non-recycled tin, silver and copper metal powder mixed with a no-clean flux. This halogen-free and lead-free solder paste is designed for extreme flux activity and the enhanced printing requirements of ultra-fine pitch applications. It provides excellent wetting on copper OSP-coatings. Wide reflow process windows combined with high thermal stability yield solder joints with smooth surfaces.

4900P is the best lead-free solder paste for facilitating high speed printing. It can yield brick-like prints even when using ultra-fine pitch stencils as small as 0.3 mm.

Features & Benefits

Alloy exceeds J-STD-006C and meets ASTM B 32 purity requirements

Flux meets J-STD-004B

Repeatable and consistent printing characteristics

Long stencil and tack life facilitate high speed printing

Excellent wettability

Suitable for air or nitrogen atmospheres

Medium-soft, non-cracking residues

Technical Datasheet (TDS)

Safety Datasheet (SDS)

Specifications

3 Produits

Features

Weight 10g—40g
Leaded Part Silver or SAC305
Solder Form Paste

Références spécifiques

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