HEAT SINK COMPOUND SYRINGE GREY HY510, 30G, 1.92W/m.K

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PID# 102902

5,50 CA$ EACH
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Description

Model; HY510

Color: Gray

Thermal Conductivity: >1.93 W/m-K

Thermal Impedance: <0.225 °C-in²/W

Specific Gravity: >2 g/cm³

Viscosity: 1000

Thixotropic Index: 380±10 1/10mm

Moment Bore Temperature: -50°C~300°C

Operation Temperature: -30°C~280°C

Ingredients

Silicone Compounds = 15%

Carbon Compounds = 35%

Metal Oxide Compounds = 50%

How to Use

Clean the CPU and heat sink surfaces, Wipe the surface lightly with a cotton ball or cotton swab dampened with alcohol.

Place a tiny drop of thermal grease to the center of the cooler base, smear it evenly with scraper or finger cot, best thickness is 0.13~0.15mm.

Attach the heat sink to the processor and avoid removing the heat sink after installing it.

Specifications

34 Produits

Features

Thermal Conductivity

Références spécifiques

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